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TetraNET Work Packages banner showing a layered microchip and circuit architecture, representing neuromorphic computing systems, ZnO tetrapod networks, and collaborative research across project work packages.

TetraNET Work Packages

The TetraNET project is structured into six interlinked work packages that collectively span materials synthesis, device development, modelling, sustainability assessment, knowledge exchange, and project coordination. Together, these work packages ensure an integrated approach from fundamental material design to proof-of-concept neuromorphic devices, while supporting responsible data management, dissemination, and long-term impact.

All Work Packages

Contacts TetraNET

Institute of Materials Science

K. Baršausko St. 59,
LT-51423 Kaunas, Lithuania
e.mail: tetranet@ktu.lt